复旦大学芯片与系统前沿技术研究院/集成芯片与系统全国重点实验室青年研究员，博士生导师，国家级青年拔尖人才。南京大学本科毕业，在中科院上海技术物理所获博士学位，曾担任中科院课题组组长。当前主要研究方向为感知计算融合芯片、深低温集成电路和新型激光雷达等，主持有国家自然科学基金等国家/省部级项目十余项，承担了国家重大项目的关键芯片研发任务，近三年以第一作者/通讯作者在DAC、CICC、ASSCC、Nature子刊、IEEE TCAS-I、TCAS-II等会议/期刊发表文章十余篇，曾在我国多项航天遥感重大型号卫星及元器件项目中担任副主任设计师或主管设计师，独立研制几十款高性能传感专用集成电路芯片，在风云四号、天宫二号、环境卫星、海洋卫星等载荷中成功在轨应用，指导的研究生曾荣获上海市优秀毕业生、国家奖学金等。

  课题组科研经费充足，流片机会较多，每年招收博士生1-2名，不定期招收博士后，欢迎对前沿技术充满好奇心的同学加入！

1. Bu Chen^#, Zhangcheng Huang^#*, Qi Zheng, Weiyi Tang, Jingyi Wang, Hankun Lv, Chixiao Chen, Jianlu Wang, Qi Liu*. CEDAR: Computing-in-pixel Edge-aware Detection and Reconstruction Architecture for High-resolution 3D Imaging[C]. 2024 61th ACM/IEEE Design Automation Conference (DAC). IEEE, 2024: 1-6.

2. Jingyi Wang#, Zhangcheng Huang^#∗, Bu Chen, Hongyang Shang, Jiapei Zheng, Hankun Lv, Chixiao Chen, Qi Liu∗, Ming Liu. (2024, April). A 32×32 Flash LiDAR SPAD Sensor with Up-to-1kfps Motional Target Detection by Threshold-adaptive 2D Dynamic Vision[C]. 2024 IEEE Custom Integrated Circuits Conference (CICC). IEEE, 2024: 1-2.

3. Jiarui Bao, Jinxin Zhang, Zhangcheng Huang*, Xingwei Feng, Zhaori Bi, Xuan Zeng*, Ye Lu*. Multiagent Based Reinforcement Learning (MA-RL): An Automated Designer for Complex Analog Circuits[J]. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2024.

4. Bu Chen#, Zhangcheng Huang^#*, Jingyi Wang, Hongyang Shang, Hankun Lv, Qi Liu*, Ming Liu. (2024, Nov). 32×32 SPAD LiDAR Sensor with In-pixel Spatial-temporal Coincidence and Per-SPAD Pulse Delay for Resolution-lossless Imaging[C]. In 2024 IEEE Asian Solid-state Circuit Conference (A-SSCC). Accepted.

5. Yihan Liu#, Weiyi Tang#, Jinhua Zeng#, Chongyang Bai, Keji Zhou, Xumeng Zhang, Qi Liu, Zhangcheng Huang*, Guangjian Wu*, Jianlu Wang*. Ferroelectric-based artificial synaptic/neuron devices for bio-inspired computing[J], Nature Reviews Electrical Engineering. Accepted.

6. Jinxin Zhang#, Jiarui Bao#, Zhangcheng Huang*, Xuan Zeng*, Ye Lu*. Automated Design of Complex Analog Circuits with Multiagent based Reinforcement Learning[C]. 2023 60th ACM/IEEE Design Automation Conference (DAC). IEEE, 2023: 1-7.

5. Zhangcheng Huang. Noise Model of Large-Format Readout Integrated Circuit for Infrared Focal Plane Array[J]. IEEE Transactions on Circuits and Systems I: Regular Papers, 2023, 70(1), 142-153.

8. Yunduo Li, Lianhua Ye, Xu Liu, Songlei Huang, Yingjie Ma, Zhangcheng Huang*, Haimei Gong*. A Full CMOS Quenching Circuit with Fuse Protection for InGaAs/InP Single Photon Detectors[J]. IEEE Transactions on Circuits and Systems II: Express Briefs, 2021, 68(10), 3224-3228.

6. 天宫二号成像光谱仪短波红外探测器读出电路芯片(2016年发射，服务至退役)

7. 风云四号（01星）扫描成像辐射计近红外探测器读出电路芯片（2016年发射，新一代气象卫星首颗星，为国家天气预报服务至今）

8. 风云四号（02星）两项载荷近红外探测器读出电路芯片（2021年发射，国家气象预报主业务卫星，服务至今）

9. 环境减灾二号卫星某载荷短波红外读出电路芯片（2020年发射，为生态环境遥感监测服务）

10. 海洋三号卫星（01星）某载荷短波红外探测器组件（截止2020年10月）及读出电路芯片（2023年发射，进入业务运行阶段）

11. 风云三号某三项载荷近红外探测器读出电路芯片